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[2015.03] Congrat!!! Faisal's paper has been published in "Nanoscale“

Writer  관리자 1  |  Date  2017.02.23 15:19:32  |  View 139

Carrier transport at the metal?MoS2 interface†

Faisal Ahmed ab, Min Sup Choi ac, Xiaochi Liu ac and Won Jong Yoo *abc
a Samsung-SKKU Graphene Center (SSGC), SKKU Advanced Institute of Nano-Technology (SAINT), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
b School of Mechanical Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea
c Department of Nano Science and Technology, SKKU Advanced Institute of Nano-Technology (SAINT), Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 440-746, Korea. E-mail: yoowj@skku.edu
Received 13th February 2015 , Accepted 13th April 2015
First published on the web 14th April 2015
This study illustrates the nature of electronic transport and its transition from one mechanism to another between a metal electrode and MoS2 channel interface in a field effect transistor (FET) device. Interestingly, measurements of the contact resistance (Rc) as a function of temperature indicate a transition in the carrier transport across the energy barrier from thermionic emission at a high temperature to tunneling at a low temperature. Furthermore, at a low temperature, the nature of the tunneling behavior is ascertained by the current?voltage dependency that helps us feature direct tunneling at a low bias and Fowler?Nordheim tunneling at a high bias for a Pd?MoS2 contact due to the effective barrier shape modulation by biasing. In contrast, only direct tunneling is observed for a Cr?MoS2 contact over the entire applied bias range. In addition, simple analytical calculations were carried out to extract Rc at the gating range, and the results are consistent with the experimental data. Our results describe the transition in carrier transport mechanisms across a metal?MoS2interface, and this information provides guidance for the design of future flexible, transparent electronic devices based on 2-dimensional materials.

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