- Equipment
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E-beam lithography Draw fine patterns (0.2 μm ~ 1800 μm)
E-beam depositionDeposit various metals (Ti, Cr, Pd, Au, Pt, Ag, Cu, Ni, Co)
IV/CV analyzerMeasure IV or CV by agilent 4155C
Optical microscopySee optical images (x25 ~ 1000)
2D material stackingStack various 2D materials
SputterSputtering
Reactive ion etcherPlasma etching by RIE method
OvenOven (RT ~ 300 ℃)
Thermal CVDThermal CVD (RT ~ 1100 ℃, @ few mtorr)
Glove boxSample treatment in Nitrogen ambient
AFM&KPFMMeasuring atomic thickness
Rapid thermal annealingRapid thermal annealing
ICP/CCP plasmaPlasma etching by ICP or CCP method
Spin coater & hot plateSpin coating
UV-1 Ozone CleanerOzone treatment with UV
Raman spectroscopyMeasure raman shifts of materials
AutofinderUsing for finding and stakcing 2d materials in a glovebox
CryostatReaching very low temperature